JPH0493143U - - Google Patents

Info

Publication number
JPH0493143U
JPH0493143U JP40456790U JP40456790U JPH0493143U JP H0493143 U JPH0493143 U JP H0493143U JP 40456790 U JP40456790 U JP 40456790U JP 40456790 U JP40456790 U JP 40456790U JP H0493143 U JPH0493143 U JP H0493143U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP40456790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP40456790U priority Critical patent/JPH0493143U/ja
Publication of JPH0493143U publication Critical patent/JPH0493143U/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Die Bonding (AREA)
JP40456790U 1990-12-25 1990-12-25 Withdrawn JPH0493143U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP40456790U JPH0493143U (en]) 1990-12-25 1990-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP40456790U JPH0493143U (en]) 1990-12-25 1990-12-25

Publications (1)

Publication Number Publication Date
JPH0493143U true JPH0493143U (en]) 1992-08-13

Family

ID=31882172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP40456790U Withdrawn JPH0493143U (en]) 1990-12-25 1990-12-25

Country Status (1)

Country Link
JP (1) JPH0493143U (en])

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19950518